Invention Grant
- Patent Title: Coaxial connectors for board-to-board interconnection
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Application No.: US17014265Application Date: 2020-09-08
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Publication No.: US11387611B2Publication Date: 2022-07-12
- Inventor: David J. Smentek , Troy I. Vanderhoof , Amit Kaistha , Thomas G. Sheehe
- Applicant: CommScope Technologies LLC
- Applicant Address: US NC Hickory
- Assignee: CommScope Technologies LLC
- Current Assignee: CommScope Technologies LLC
- Current Assignee Address: US NC Hickory
- Agency: Myers Bigel, P.A.
- Main IPC: H01R9/05
- IPC: H01R9/05 ; H01R24/50 ; H01R12/71 ; H01Q1/50

Abstract:
An assembly includes: first and second printed circuit boards (PCBs), the PCBs being disposed generally parallel to each other; a first coaxial connector mounted to the first PCB, the first coaxial connector comprising a first inner contact and a first outer connector body, the first outer connector body having a first thickness; and a second coaxial connector mounted to the second PCB, the second axial connector comprising a second inner contact and a second outer connector body. The second outer connector body includes an engagement surface, the engagement surface being flexible in a direction normal to the second PCB, the engagement surface having a second thickness that is greater than the first thickness.
Public/Granted literature
- US20210098953A1 COAXIAL CONNECTORS FOR BOARD-TO-BOARD INTERCONNECTION Public/Granted day:2021-04-01
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