An induction cooking apparatus includes an induction coil forming a top surface and a bottom surface. The induction coil includes a plurality of conductive windings. A temperature sensor protrudes through the top surface of the induction coil. An electrical circuit is in communication with the temperature sensor. The electrical circuit is disposed on a substrate, which may form a chassis configured to support a plurality of conductive connections. The substrate forms a spring mechanism in connection with the temperature sensor.