Invention Grant
- Patent Title: Substrate and manufacturing method therefor, and electronic apparatus
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Application No.: US17170437Application Date: 2021-02-08
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Publication No.: US11417713B2Publication Date: 2022-08-16
- Inventor: Lujiang Huangfu , Libin Liu , Yipeng Chen
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Dave Law Group LLC
- Agent Raj S. Dave
- Priority: CN201711376371.X 20171219
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L27/11 ; H01L27/01

Abstract:
A substrate and a manufacturing method therefor, and an electronic device are provided. The substrate includes: a base substrate including a working region, and a non-working region outside of the working region, the non-working region including a peripheral circuit region near the working region and a non-circuit region away from the working region; a peripheral circuit in the peripheral circuit region; a common electrode lead in the non-working region; a common electrode; and a bridging conductive layer made of opaque conductive material in the non-working region and electrically connects the common electrode and the common electrode lead. An orthographic projection of the bridging conductive layer on the base substrate at least partially coincides with an orthographic projection of the peripheral circuit region on the base substrate, and bridging conductive layer is insulated from the peripheral circuit.
Public/Granted literature
- US20210167142A1 SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS Public/Granted day:2021-06-03
Information query
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