Invention Grant
- Patent Title: Structure and formation method of semiconductor device with metal gate stack
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Application No.: US16943672Application Date: 2020-07-30
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Publication No.: US11417745B2Publication Date: 2022-08-16
- Inventor: Jia-Chuan You , Huan-Chieh Su , Kuo-Cheng Chiang , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/8234 ; H01L27/088 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device structure and the fabrication method are provided. The semiconductor device structure includes a first channel structure and a second channel structure over a substrate. The second channel structure is longer than the first channel structure. The semiconductor device structure also includes a first gate stack over the first channel structure, and the first gate stack has a first width. The semiconductor device structure further includes a first gate spacer extending along a sidewall of the first gate stack. In addition, the semiconductor device structure includes a second gate stack over the second channel structure and a second gate spacer extending along a sidewall of the second gate stack. The second gate stack has a portion extending along the second gate spacer, and the portion of the second gate stack has a second width. Half of the first width is greater than the second width.
Public/Granted literature
- US20220037491A1 STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH METAL GATE STACK Public/Granted day:2022-02-03
Information query
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