Invention Grant
- Patent Title: Mold assembly for injection molding
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Application No.: US16073055Application Date: 2017-01-19
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Publication No.: US11426907B2Publication Date: 2022-08-30
- Inventor: Joonsang Yang , Kyungdo Kim , Seokjae Jeong , Youngkyu Kim
- Applicant: LG Electronics Inc.
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: Fish & Richardson P.C.
- Priority: KR10-2016-0009664 20160126
- International Application: PCT/KR2017/000654 WO 20170119
- International Announcement: WO2017/131386 WO 20170803
- Main IPC: B29C45/00
- IPC: B29C45/00 ; B29C45/27 ; B29C45/26 ; B29C45/76 ; B29K505/00

Abstract:
Disclosed is a mold assembly comprising: a cavity forming an inner space to be filled with resin containing metallic particles, and having a protruding part corresponding to a hole of a molded object; a first gate disposed at any one side of the cavity so as to inject the resin into the inner space; and a second gate disposed at another side of the cavity, and injecting the resin, which flows in a second direction intersecting with a first direction, into the inner space so as to change the arrangement of the metallic particles such that a weld line, formed according to the orientation of metallic particle in the first direction, is blurred in an area at which the flow of the resin is separated by the protruding part and then comes back together.
Public/Granted literature
- US20190030770A1 MOLD ASSEMBLY FOR INJECTION MOLDING Public/Granted day:2019-01-31
Information query