Invention Grant
- Patent Title: Sensor assemblies for electronic devices
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Application No.: US17192722Application Date: 2021-03-04
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Publication No.: US11429158B2Publication Date: 2022-08-30
- Inventor: Lucy Elizabeth Browning , Benjamin J. Pope , Paul U. Leutheuser , Scott A. Myers , Richard Hung Minh Dinh , Edward S. Huo
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Dorsey & Whitney LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H03K17/96 ; H03K17/975 ; G06V40/13 ; G06F3/01 ; G06F3/16

Abstract:
Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.
Public/Granted literature
- US20210191458A1 SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES Public/Granted day:2021-06-24
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