Invention Grant
- Patent Title: Method and apparatus for processing three-dimensional data
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Application No.: US17048757Application Date: 2019-04-22
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Publication No.: US11430185B2Publication Date: 2022-08-30
- Inventor: Jihwan Woo , Youngho Oh , Sungryeul Rhyu
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2018-0046311 20180420
- International Application: PCT/KR2019/004839 WO 20190422
- International Announcement: WO2019/203628 WO 20191024
- Main IPC: G06T7/90
- IPC: G06T7/90 ; G06T9/00 ; G06T19/00 ; G06T7/136 ; G06T7/50

Abstract:
A method and an apparatus for compressing the three-dimensional data of a point cloud are disclosed. The present invention comprises, identifying a plurality of points constituting a point cloud, and projecting the plurality of identified points onto a projection plane so as to generate a projection image, wherein the bit number of projection points corresponding to the plurality of points projected in the projection image is determined on the basis of the distance between a first point closest to the projection plane and a second point farthest therefrom, on a normal with respect to the projection plane, among the plurality of points and/or on the basis of the number of intermediate points located between the first point and the second point.
Public/Granted literature
- US20210158617A1 METHOD AND APPARATUS FOR PROCESSING THREE-DIMENSIONAL DATA Public/Granted day:2021-05-27
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