- 专利标题: Method for preparing interlayer insulating layer and method for manufacturing thin film transistor, thin film transistor
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申请号: US16862865申请日: 2020-04-30
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公开(公告)号: US11430816B2公开(公告)日: 2022-08-30
- 发明人: Ming Wang , Ce Zhao , Wei Song
- 申请人: BOE TECHNOLOGY GROUP CO., LTD.
- 申请人地址: CN Beijing
- 专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人地址: CN Beijing
- 代理机构: Nath, Goldberg & Meyer
- 代理商 Joshua B. Goldberg
- 优先权: CN201910730276.8 20190808
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/786 ; C23C16/34 ; C23C16/40 ; H01L29/66 ; H01L27/12 ; H01L21/02
摘要:
The present disclosure provides a method for preparing an interlayer insulating layer and a method for manufacturing a thin film transistor, and a thin film transistor, belongs to the field of display technology, and can solve the problem of poor resistance to breakdown of the interlayer insulating layer in the related art. The method for preparing an interlayer insulating layer includes the following steps: forming a silicon oxide layer with a first reaction gas and forming a silicon nitride layer with a second reaction gas such that hydrogen content in the silicon nitride layer is less than or equal to hydrogen content in the silicon oxide layer.
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