Invention Grant
- Patent Title: Back cover ejection structure
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Application No.: US17231879Application Date: 2021-04-15
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Publication No.: US11432414B2Publication Date: 2022-08-30
- Inventor: Chia-Ju Lin
- Applicant: Chiun Mai Communication Systems, Inc.
- Applicant Address: TW New Taipei
- Assignee: Chiun Mai Communication Systems, Inc.
- Current Assignee: Chiun Mai Communication Systems, Inc.
- Current Assignee Address: TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN202010300974.7 20200416
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K5/03 ; F16H57/02 ; F16H37/12 ; H04M1/02

Abstract:
A back cover ejection structure is applied in an electronic device. The electronic device includes a back cover and a middle frame, the back cover ejection structure can eject the back cover from the middle frame. The back cover ejection structure includes a housing, a moving plate, and a rotating cover. The moving plate is received in the housing and can move in a first direction. The moving plate includes a plate body and a first groove defined in the plate body. The first groove includes a first section, the first section inclined with the first direction. The rotating cover is rotatably connected to the housing. The rotating cover includes a sliding rod slidably received in the first section. The sliding rod can push the rotating cover to rotate when sliding in the first section, causing the rotating cover to eject the back cover from the middle frame.
Public/Granted literature
- US20210329798A1 BACK COVER EJECTION STRUCTURE Public/Granted day:2021-10-21
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