Invention Grant
- Patent Title: Insulated wire
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Application No.: US16909861Application Date: 2020-06-23
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Publication No.: US11437167B2Publication Date: 2022-09-06
- Inventor: Akira Tachibana , Shoichi Danjo
- Applicant: ESSEX FURUKAWA MAGNET WIRE JAPAN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: ESSEX FURUKAWA MAGNET WIRE JAPAN CO., LTD.
- Current Assignee: ESSEX FURUKAWA MAGNET WIRE JAPAN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2018-001677 20180110
- Main IPC: H01B7/02
- IPC: H01B7/02 ; H01B7/29 ; H01B1/02 ; H01B3/30 ; H01B3/36

Abstract:
An insulated wire includes: a copper alloy conductor; and at least one resin layer directly or indirectly coated on an outer peripheral face of the copper alloy conductor, in which the copper alloy conductor has a composition where a total content of metal components selected from Al, Be, Cd, Mg, Pb, Ni, P, Sn, and Cr is from 0.1 to 2.0 ppm and content of copper is 99.96 mass % or higher, and has a specific texture where an average orientation density in an area where φ2=0 degrees, φ1=0 degrees, and Φ=from 0 degrees to 90 degrees is from 3.0 to less than 35.0, and a maximum orientation density in an area where φ2=35 degrees, φ1=from 45 degrees to 55 degrees, and Φ=from 65 degrees to 80 degrees is from 1.0 to less than 30.0.
Public/Granted literature
- US20200328009A1 INSULATED WIRE Public/Granted day:2020-10-15
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