- 专利标题: Multilevel semiconductor device and structure with oxide bonding
-
申请号: US17717094申请日: 2022-04-10
-
公开(公告)号: US11437368B2公开(公告)日: 2022-09-06
- 发明人: Zvi Or-Bach , Deepak C. Sekar , Brian Cronquist
- 申请人: Monolithic 3D Inc.
- 申请人地址: US OR Klamath Falls
- 专利权人: Monolithic 3D Inc.
- 当前专利权人: Monolithic 3D Inc.
- 当前专利权人地址: US OR Klamath Falls
- 代理机构: Patent pc
- 代理商 Bao Tran
- 主分类号: H01L27/06
- IPC分类号: H01L27/06 ; H01L23/66 ; H01L27/146 ; H01L27/15
摘要:
A multi-level semiconductor device, the device including: a first level including integrated circuits; a second level including a structure designed to conduct electromagnetic waves, where the second level is disposed above the first level, where the first level includes crystalline silicon; and an oxide layer disposed between the first level and the second level, where the second level is bonded to the oxide layer, and where the bonded includes oxide to oxide bonds.
公开/授权文献
信息查询
IPC分类: