- 专利标题: Trench MOSFET and method of manufacturing trench MOSFET
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申请号: US17253597申请日: 2019-12-27
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公开(公告)号: US11437510B2公开(公告)日: 2022-09-06
- 发明人: Xuan Xiao , Jun Ye , Jie Li
- 申请人: WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.
- 申请人地址: CN Jiangsu
- 专利权人: WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.
- 当前专利权人: WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.
- 当前专利权人地址: CN Jiangsu
- 代理机构: McCoy Russell LLP
- 优先权: CN201811607412.6 20181227
- 国际申请: PCT/CN2019/129261 WO 20191227
- 国际公布: WO2020/135735 WO 20200702
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/765 ; H01L29/06 ; H01L29/10 ; H01L29/40 ; H01L29/66
摘要:
The present disclosure discloses a trench MOSFET and a method of manufacturing trench MOSFET. The trench MOSFET includes a substrate, an epitaxial layer, a plurality of trenches, and body region; the substrate has a first conductivity type; the epitaxial layer has the first conductivity type; the plurality of trenches are formed in the epitaxial layer, and at least two of the plurality of trenches are communicated with each other a gate structure is provided in the trench; the body region has a second conductivity type and has a second conductivity type and is disposed among the plurality of trenches.
公开/授权文献
- US20210273092A1 TRENCH MOSFET AND METHOD OF MANUFACTURING TRENCH MOSFET 公开/授权日:2021-09-02
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