Disclosed is a method of fabricating a stretchable electronic device, the method including a step of forming one or more semiconductor devices on a first carrier substrate; a step of forming semiconductor device array patterns by separating semiconductor device arrays each including the semiconductor devices; a step of releasing the semiconductor device array patterns from the first carrier substrate; a step of forming a stretchable substrate on a second carrier substrate; and a step of transferring the released semiconductor device array patterns onto the stretchable substrate.