Invention Grant
- Patent Title: Coil component and coil device
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Application No.: US16392834Application Date: 2019-04-24
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Publication No.: US11443888B2Publication Date: 2022-09-13
- Inventor: Syun Ashizawa , Takahiro Banzai , Satoshi Sugimoto , Hitoshi Sasaki
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-090812 20180509
- Main IPC: H01F27/02
- IPC: H01F27/02 ; H01F27/28 ; H01F27/32 ; H01F27/255

Abstract:
A coil component including a first conductive plate part formed with a first coil pattern having a first opening, and a second conductive plate part formed with a second coil pattern having a second opening and disposed at a predetermined interval in the laminating direction with respect to the first conductive plate part. The first conductive plate part and the second conductive plate part are made of the same single plate and are integrally formed by a bent joining segment.
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