公开(公告)号：US20190237245A1

公开(公告)日：2019-08-01

申请号：US16253044

申请日：2019-01-21

Applicant: TDK Corporation

Inventor： Syun Ashizawa ,  Satoshi Sugimoto ,  Takahiro Banzai ,  Hitoshi Sasaki

IPC: H01F27/28 ,  H01F27/24 ,  H01F27/29 ,  H01F27/32 ,  H01F41/12

CPC classification number: H01F27/2852 ,  H01F27/24 ,  H01F27/29 ,  H01F27/324 ,  H01F41/125

Abstract: Disclosed herein is a coil component that includes a conductor plate; and a magnetic core comprising a magnetic material having conductivity, the magnetic core having a through hole into which the conductor plate is inserted. The conductor plate includes: a metal element body having a body part positioned inside the through hole and a terminal part positioned outside the through hole; a metal film formed on the terminal part, the metal film comprising a metal material having a lower melting point than the metal element body; and an insulating film formed on a surface of the body part without the metal film interposed.

公开(公告)号：US11328855B2

公开(公告)日：2022-05-10

申请号：US16253044

申请日：2019-01-21

Applicant: TDK Corporation

Inventor： Syun Ashizawa ,  Satoshi Sugimoto ,  Takahiro Banzai ,  Hitoshi Sasaki

IPC: H01F27/29 ,  H01F27/28 ,  H01F27/24 ,  H01F41/12 ,  H01F27/32

Abstract: Disclosed herein is a coil component that includes a conductor plate; and a magnetic core comprising a magnetic material having conductivity, the magnetic core having a through hole into which the conductor plate is inserted. The conductor plate includes: a metal element body having a body part positioned inside the through hole and a terminal part positioned outside the through hole; a metal film formed on the terminal part, the metal film comprising a metal material having a lower melting point than the metal element body; and an insulating film formed on a surface of the body part without the metal film interposed.

公开(公告)号：US12009135B2

公开(公告)日：2024-06-11

申请号：US17186425

申请日：2021-02-26

Applicant: TDK CORPORATION

Inventor： Syun Ashizawa ,  Takahiro Banzai ,  Riku Umeki ,  Satoshi Sugimoto ,  Hitoshi Sasaki

IPC: H01F27/24 ,  H01F3/14 ,  H01F17/04 ,  H01F27/26 ,  H01F27/28 ,  H01F27/29 ,  H01F41/04

CPC classification number: H01F27/24 ,  H01F3/14 ,  H01F17/04 ,  H01F27/263 ,  H01F27/2852 ,  H01F27/29 ,  H01F41/04

Abstract: A coil device includes a main core and a sub core. The main core includes a middle leg for winding a coil body and an outer leg connected with the middle leg via a base portion. The sub core is disposed to face the base portion across the middle leg. A gap between the middle leg and the sub core is wider than that between the outer leg and the sub core.

公开(公告)号：US11443888B2

公开(公告)日：2022-09-13

申请号：US16392834

申请日：2019-04-24

Applicant: TDK CORPORATION

Inventor： Syun Ashizawa ,  Takahiro Banzai ,  Satoshi Sugimoto ,  Hitoshi Sasaki

IPC: H01F27/02 ,  H01F27/28 ,  H01F27/32 ,  H01F27/255

Abstract: A coil component including a first conductive plate part formed with a first coil pattern having a first opening, and a second conductive plate part formed with a second coil pattern having a second opening and disposed at a predetermined interval in the laminating direction with respect to the first conductive plate part. The first conductive plate part and the second conductive plate part are made of the same single plate and are integrally formed by a bent joining segment.