- 专利标题: Coil component and coil device
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申请号: US16392834申请日: 2019-04-24
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公开(公告)号: US11443888B2公开(公告)日: 2022-09-13
- 发明人: Syun Ashizawa , Takahiro Banzai , Satoshi Sugimoto , Hitoshi Sasaki
- 申请人: TDK CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: TDK CORPORATION
- 当前专利权人: TDK CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff PLC
- 优先权: JPJP2018-090812 20180509
- 主分类号: H01F27/02
- IPC分类号: H01F27/02 ; H01F27/28 ; H01F27/32 ; H01F27/255
摘要:
A coil component including a first conductive plate part formed with a first coil pattern having a first opening, and a second conductive plate part formed with a second coil pattern having a second opening and disposed at a predetermined interval in the laminating direction with respect to the first conductive plate part. The first conductive plate part and the second conductive plate part are made of the same single plate and are integrally formed by a bent joining segment.
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