Invention Grant
- Patent Title: Semiconductor device and corresponding method
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Application No.: US17108471Application Date: 2020-12-01
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Publication No.: US11443958B2Publication Date: 2022-09-13
- Inventor: Roseanne Duca , Dario Paci , Pierpaolo Recanatini
- Applicant: STMicroelectronics S.r.l. , STMicroelectronics (Malta) Ltd
- Applicant Address: IT Agrate Brianza; MT Kirkop
- Assignee: STMicroelectronics S.r.l.,STMicroelectronics (Malta) Ltd
- Current Assignee: STMicroelectronics S.r.l.,STMicroelectronics (Malta) Ltd
- Current Assignee Address: IT Agrate Brianza; MT Kirkop
- Agency: Crowe & Dunlevy
- Priority: IT102019000022656 20191202
- Main IPC: H01L21/324
- IPC: H01L21/324 ; H01L23/16 ; H01L23/31

Abstract:
A leadframe includes a die pad and a set of electrically conductive leads. A semiconductor die, having a front surface and a back surface opposed to the front surface, is arranged on the die pad with the front surface facing away from the die pad. The semiconductor die is electrically coupled to the electrically conductive leads. A package molding material is molded over the semiconductor die arranged on the die pad. A stress absorbing material contained within a cavity delimited by a peripheral wall on the front surface of the semiconductor die is positioned intermediate at least one selected portion of the front surface of the semiconductor die and the package molding material.
Public/Granted literature
- US20210166949A1 SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD Public/Granted day:2021-06-03
Information query
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