Invention Grant
- Patent Title: Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board
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Application No.: US16916229Application Date: 2020-06-30
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Publication No.: US11445605B2Publication Date: 2022-09-13
- Inventor: Takaaki Morita , Seiko Komatsu , Seiichi Tajima , Wakiko Sato
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2019-127124 20190708
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/09 ; H05K1/11 ; H05K3/00 ; H05K1/02
Abstract:
A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.
Public/Granted literature
- US20210014966A1 PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD Public/Granted day:2021-01-14
Information query
