公开(公告)号：US11546989B2

公开(公告)日：2023-01-03

申请号：US16813025

申请日：2020-03-09

Applicant: TDK CORPORATION

Inventor： Seiko Komatsu ,  Takaaki Morita ,  Seiichi Tajima

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46

Abstract: A multilayer board insulating sheet contains a reducing agent.

公开(公告)号：US11445605B2

公开(公告)日：2022-09-13

申请号：US16916229

申请日：2020-06-30

Applicant: TDK CORPORATION

Inventor： Takaaki Morita ,  Seiko Komatsu ,  Seiichi Tajima ,  Wakiko Sato

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K1/02

Abstract: A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

公开(公告)号：US11412621B2

公开(公告)日：2022-08-09

申请号：US16812671

申请日：2020-03-09

Applicant: TDK CORPORATION

Inventor： Takaaki Morita ,  Seiichi Tajima ,  Takashi Kariya

IPC: H05K1/16 ,  H05K1/18 ,  H05K3/20 ,  H01L23/64 ,  H01L23/66 ,  H01L23/495 ,  H01L23/522 ,  H01F27/24 ,  H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H05K3/46 ,  H05K1/11 ,  H05K3/10 ,  H05K1/03

Abstract: A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.

公开(公告)号：US11382218B2

公开(公告)日：2022-07-05

申请号：US16421547

申请日：2019-05-24

Applicant: TDK CORPORATION

Inventor： Takaaki Morita ,  Seiichi Tajima ,  Takashi Kariya

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/46 ,  H01L21/02 ,  H01L21/48 ,  H01L21/56 ,  H01L23/34 ,  H01L23/52 ,  H01L23/495 ,  H05K3/40

Abstract: In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.

公开(公告)号：US10905013B2

公开(公告)日：2021-01-26

申请号：US16422248

申请日：2019-05-24

Applicant: TDK CORPORATION

Inventor： Takaaki Morita ,  Seiichi Tajima ,  Takashi Kariya

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/18 ,  H05K3/00 ,  H05K1/11

Abstract: In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.