- 专利标题： Electronic component and its manufacturing method
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申请号： US17134316申请日： 2020-12-26
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公开(公告)号： US11452209B2公开(公告)日： 2022-09-20
- 发明人: Yuichiro Okuyama , Takeshi Oohashi , Hajime Kuwajima , Takashi Ohtsuka , Kazuhiro Yoshikawa , Kenichi Yoshida
- 申请人： TDK CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： TDK CORPORATION
- 当前专利权人： TDK CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Young Law Firm, P.C.
- 优先权： JPJP2020-002924 20200110
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K1/16 ; H05K1/14
摘要：
Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.
公开/授权文献
- US20210219430A1 ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD 公开/授权日：2021-07-15
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