公开(公告)号：US11967469B2

公开(公告)日：2024-04-23

申请号：US17330929

申请日：2021-05-26

Applicant: TDK CORPORATION

Inventor： Hajime Kuwajima ,  Takashi Ohtsuka ,  Takeshi Oohashi ,  Yuichiro Okuyama

IPC: H01G4/40 ,  H01G4/228 ,  H01G4/33

CPC classification number: H01G4/40 ,  H01G4/228 ,  H01G4/33

Abstract: Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.

公开(公告)号：US11545303B2

公开(公告)日：2023-01-03

申请号：US17143581

申请日：2021-01-07

Applicant: TDK CORPORATION

Inventor： Kazuhiro Yoshikawa ,  Kenichi Yoshida ,  Takashi Ohtsuka ,  Yuichiro Okuyama ,  Takeshi Oohashi ,  Hajime Kuwajima

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/08

Abstract: Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

公开(公告)号：US11452209B2

公开(公告)日：2022-09-20

申请号：US17134316

申请日：2020-12-26

Applicant: TDK CORPORATION

Inventor： Yuichiro Okuyama ,  Takeshi Oohashi ,  Hajime Kuwajima ,  Takashi Ohtsuka ,  Kazuhiro Yoshikawa ,  Kenichi Yoshida

IPC: H05K1/02 ,  H05K1/16 ,  H05K1/14

Abstract: Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

公开(公告)号：US11328872B2

公开(公告)日：2022-05-10

申请号：US16724760

申请日：2019-12-23

Applicant: TDK CORPORATION

Inventor： Yoshihiro Shinkai ,  Yuichiro Okuyama ,  Tomoya Hanai ,  Yusuke Ariake ,  Isao Kanada ,  Takashi Ohtsuka

IPC: H01G4/40 ,  H01F27/24 ,  H01F27/28 ,  H01F27/40

Abstract: An LC composite component includes a non-magnetic substrate, a magnetic layer with magnetism, capacitors, inductors, and core parts with magnetism. The non-magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the non-magnetic substrate. The inductors and the capacitors are disposed between the first surface of the non-magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the non-magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core parts is 1.0 or more times the thickness of the magnetic layer in a direction perpendicular to the first surface of the non-magnetic substrate, and each of the magnetic layer and the core parts contains magnetic metal particles and resin.

公开(公告)号：US11776947B2

公开(公告)日：2023-10-03

申请号：US17206656

申请日：2021-03-19

Applicant: TDK CORPORATION

Inventor： Yusuke Oba ,  Kenichi Yoshida ,  Takashi Ohtsuka ,  Yuichiro Okuyama ,  Tomoya Hanai ,  Yu Fukae

IPC: H01L25/18 ,  H01L27/01 ,  H01L21/70 ,  H01L21/78 ,  H01L49/02

CPC classification number: H01L25/18 ,  H01L21/707 ,  H01L21/78 ,  H01L27/016 ,  H01L28/10 ,  H01L28/40

Abstract: Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.

公开(公告)号：US11515854B2

公开(公告)日：2022-11-29

申请号：US16725581

申请日：2019-12-23

Applicant: TDK Corporation

Inventor： Yoshihiro Shinkai ,  Yuichiro Okuyama ,  Yusuke Ariake ,  Tomoya Hanai ,  Isao Kanada ,  Takashi Ohtsuka

IPC: H03H7/01 ,  H01F17/00 ,  H01F27/29 ,  H05K1/18 ,  H03H1/00

Abstract: An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer.

公开(公告)号：US20190313528A1

公开(公告)日：2019-10-10

申请号：US16374556

申请日：2019-04-03

Applicant: TDK Corporation

Inventor： Hajime Kuwajima ,  Tomonaga Nishikawa ,  Takashi Ohtsuka ,  Takeshi Oohashi ,  Yuichiro Okuyama ,  Manabu Yamatani

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/46 ,  H05K3/06

Abstract: Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.

公开(公告)号：US10426032B1

公开(公告)日：2019-09-24

申请号：US16374556

申请日：2019-04-03

Applicant: TDK Corporation

Inventor： Hajime Kuwajima ,  Tomonaga Nishikawa ,  Takashi Ohtsuka ,  Takeshi Oohashi ,  Yuichiro Okuyama ,  Manabu Yamatani

IPC: H05K1/09 ,  H05K1/02 ,  H05K3/02 ,  H05K1/11 ,  H05K3/06 ,  H05K3/46

Abstract: Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.