Invention Grant
- Patent Title: Ultrasonic element and ultrasonic device
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Application No.: US16660847Application Date: 2019-10-23
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Publication No.: US11453031B2Publication Date: 2022-09-27
- Inventor: Hironori Suzuki , Chikara Kojima , Koji Ohashi , Yasuyuki Matsumoto , Katsuhiro Imai
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2018-200018 20181024
- Main IPC: B06B1/06
- IPC: B06B1/06 ; H01L41/047 ; H01L41/053 ; B06B1/02 ; H01L41/23 ; H01L41/08 ; H01L41/04

Abstract:
An ultrasonic element includes an element substrate including a first surface, a second surface having a front-back relation with the first surface, an opening section piercing through the element substrate from the first surface to the second surface, and a partition wall section surrounding the opening section, a supporting film provided on the first surface of the element substrate to cover the opening section and including a third surface facing the opening section and a fourth surface having a front-back relation with the third surface, a piezoelectric element provided on the fourth surface of the supporting film and disposed in a region overlapping the opening section of the supporting film in a plan view from a film thickness direction extending from the third surface to the fourth surface, a sealing plate provided to be opposed to the fourth surface of the supporting film and joined to the supporting film by an adhesive member via a beam section projecting toward the supporting film, and a wall section provided on the fourth surface of the supporting film and provided to project toward the sealing plate between the beam section and the piezoelectric element.
Information query
IPC分类: