Invention Grant
- Patent Title: Cover plate and manufacturing method thereof, electronic device
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Application No.: US16168333Application Date: 2018-10-23
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Publication No.: US11455824B2Publication Date: 2022-09-27
- Inventor: Dejun Bu , Paoming Tsai , Jianwei Li
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Collard & Roe, P.C.
- Priority: CN201711064434.8 20171102
- Main IPC: G06V40/13
- IPC: G06V40/13 ; H05K5/03 ; G06F3/042 ; G06F3/041

Abstract:
A cover plate and a manufacturing method thereof, an electronic device are disclosed. The cover plate includes an operation area, the operation area includes an identification area and a non-identification area, the cover plate includes a contact surface, the contact surface includes a first contact surface and a second contact surface, the first contact surface is in the identification area, the second contact surface is in the non-identification area, and the first contact surface and the second contact surface have different contact properties.
Public/Granted literature
- US20190130158A1 COVER PLATE AND MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE Public/Granted day:2019-05-02
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