Invention Grant
- Patent Title: Stage structure for semiconductor fabrication process, system of picking up semiconductor chip, and method of controlling tilting angle of pickup head
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Application No.: US17330940Application Date: 2021-05-26
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Publication No.: US11456202B2Publication Date: 2022-09-27
- Inventor: Jin-San Jung , Hyunseok Choi , Jun-Su Lim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2020-0137823 20201022
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/68 ; H01L21/687 ; H01L21/67 ; B05B5/08
Abstract:
A stage structure for a semiconductor fabrication process is disclosed. The stage structure may include a stage and a pickup head tilting control device. The pickup head tilting control device may include a correction plate, a tilting driving device which is coupled to the correction plate and is configured to adjust an inclination angle of the correction plate, and a control circuitry configured to control the tilting driving device. The correction plate may include a correction surface which is selectively in contact with a suction surface of a pickup head.
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