Invention Grant
- Patent Title: Power backplane assembly and power supply module
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Application No.: US16742914Application Date: 2020-01-15
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Publication No.: US11456549B2Publication Date: 2022-09-27
- Inventor: Chien-Li Tsai , Yao-Cheng Tsai
- Applicant: FSP TECHNOLOGY INC.
- Applicant Address: TW Taoyuan
- Assignee: FSP TECHNOLOGY INC.
- Current Assignee: FSP TECHNOLOGY INC.
- Current Assignee Address: TW Taoyuan
- Agency: JCIPRNET
- Priority: TW108106104 20190222
- Main IPC: H01R12/70
- IPC: H01R12/70 ; G06F1/18

Abstract:
A power backplane assembly is adapted to be connected to a power supply. The power supply outputs a first voltage. The power backplane assembly includes a backplane body, a conversion circuit board, and an output circuit board. The backplane body is for plugging in the power supply. The conversion circuit board is electrically connected to the backplane body. The backplane body is adapted to deliver the first voltage to the conversion circuit board. The conversion circuit board converts the first voltage into a second voltage. The output circuit board is electrically connected to the conversion circuit board and includes a first output connector and a second output connector. The first output connector is configured to output the first voltage, and the second output connector is at least configured to output the second voltage. A power supply module which has the power backplane assembly is also provided.
Public/Granted literature
- US20200274271A1 POWER BACKPLANE ASSEMBLY AND POWER SUPPLY MODULE Public/Granted day:2020-08-27
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