Invention Grant
- Patent Title: Electronic component, electric device including the same, and bonding method thereof
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Application No.: US16422277Application Date: 2019-05-24
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Publication No.: US11457531B2Publication Date: 2022-09-27
- Inventor: Han-Sung Bae , Wonkyu Kwak , Cheolgeun An
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: Kile Park Reed & Houtteman PLLC
- Priority: KR10-2013-0047535 20130429,KR10-2014-0043134 20140410,KR10-2014-0043136 20140410,KR10-2014-0079080 20140626
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11 ; H01L23/00 ; G02F1/1345 ; H05K3/36 ; H05K3/30 ; H01L23/495

Abstract:
Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.
Public/Granted literature
- US20190281699A1 ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF Public/Granted day:2019-09-12
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