Invention Grant
- Patent Title: Composition for tin or tin alloy electroplating comprising suppressing agent
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Application No.: US16954333Application Date: 2018-12-10
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Publication No.: US11459665B2Publication Date: 2022-10-04
- Inventor: Alexander Fluegel , Marco Arnold , Marcel Patrik Kienle , Nadine Engelhardt
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen am Rhein
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen am Rhein
- Agency: Armstrong Teasdale LLP
- Priority: EP17209034 20171220
- International Application: PCT/EP2018/084122 WO 20181210
- International Announcement: WO2019/121092 WO 20190627
- Main IPC: C25D3/60
- IPC: C25D3/60 ; C25D3/32 ; C25D5/02 ; C25D7/12

Abstract:
Described herein is an aqueous composition including tin ions and at least one compound of formula I where X1, X2 are independently selected from a linear or branched C1-C12 alkanediyl, R11 is a monovalent group of formula —(O—CH2—CHR41)m—OR42, R12, R13, R14 are independently selected from H, R11, and R40; R15 is selected from H, R11, R40 and —X4—N(R21)2, X4 is a divalent group selected from (a) a linear or branched C1 to C12 alkanediyl, and (b) formula —(O—CH2—CHR41)o—, R21 is selected from R11 and R40, R40 is a linear or branched C1-C20 alkyl, R41 is selected from H and a linear or branched C1 to C5 alkyl, R42 is selected from H and a linear or branched C1-C20 alkyl, n is an integer of from 1 to 6, m is an integer of from 2 to 250, and o is an integer of from 1 to 250.
Public/Granted literature
- US20210079548A1 COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESSING AGENT Public/Granted day:2021-03-18
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