- 专利标题： Modular solderless connector integration for conformal phased arrays
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申请号： US16864719申请日： 2020-05-01
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公开(公告)号： US11462869B2公开(公告)日： 2022-10-04
- 发明人: Anna Stumme , William Mark Dorsey , John A. Valenzi
- 申请人： The Government of the United States of America, as represented by the Secretary of the Navy
- 申请人地址： US VA Arlington
- 专利权人： The Government of the United States of America, as represented by the Secretary of the Navy
- 当前专利权人： The Government of the United States of America, as represented by the Secretary of the Navy
- 当前专利权人地址： US VA Arlington
- 代理机构： US Naval Research Laboratory
- 代理商 Hong-Vinh Nguyen
- 主分类号： H01Q1/08
- IPC分类号： H01Q1/08 ; H01R24/52 ; H01Q1/48 ; H01R13/627 ; H01Q1/36 ; H01Q21/00
摘要：
A novel, interlocking, snap-fit connection between an antenna aperture and a ground plane layer that contains coaxial connectors is described herein. The snap-fit design provides a simple and solderless transition from the connectors to elements of the antenna aperture. This design facilitates easy assembly and disassembly, allowing parts to be removed, reinstalled and/or reused.
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