Invention Grant
- Patent Title: Electronic device and electronic device housing structure
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Application No.: US16969086Application Date: 2019-02-11
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Publication No.: US11463570B2Publication Date: 2022-10-04
- Inventor: Minwoo Yoo , Hyeongsam Son , Byounguk Yoon , Minsung Lee , Chongkun Cho , Jongchul Choi , Changryong Heo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2018-0017117 20180212
- International Application: PCT/KR2019/001633 WO 20190211
- International Announcement: WO2019/156519 WO 20190815
- Main IPC: H05K5/03
- IPC: H05K5/03 ; H04M1/02 ; H05K5/00 ; H05K5/02
Abstract:
Various embodiments disclosed in this document relate to an electronic device, for example, an electronic device comprising a conductive piece facing a housing of a metallic material, and an electronic device housing structure.
Public/Granted literature
- US20210037126A1 ELECTRONIC DEVICE AND ELECTRONIC DEVICE HOUSING STRUCTURE Public/Granted day:2021-02-04
Information query
