Invention Grant
- Patent Title: Backplane and glass-based circuit board
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Application No.: US16961439Application Date: 2019-09-30
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Publication No.: US11469359B2Publication Date: 2022-10-11
- Inventor: Wengang Su , Wei Hao , Haiwei Sun , Lingyun Shi , Feifei Wang , Rui Shi
- Applicant: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing; CN Beijing
- Assignee: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing; CN Beijing
- Agency: Leason Ellis LLP
- International Application: PCT/CN2019/109452 WO 20190930
- International Announcement: WO2021/062630 WO 20210408
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L25/075 ; H01L33/60 ; H01L23/48

Abstract:
A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units (110) includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line (200) and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The light-emitting diode chips (300) in the at least one light-emitting sub-unit are connected in series.
Public/Granted literature
- US20220005990A1 BACKPLANE AND GLASS-BASED CIRCUIT BOARD Public/Granted day:2022-01-06
Information query
IPC分类: