• Patent Title: Fluid chip, fluid device, and method for manufacturing same
  • Application No.: US16765258
    Application Date: 2018-11-09
  • Publication No.: US11471883B2
    Publication Date: 2022-10-18
  • Inventor: Takumi YamauchiNobuya Sunaga
  • Applicant: Enplas Corporation
  • Applicant Address: JP Kawaguchi
  • Assignee: Enplas Corporation
  • Current Assignee: Enplas Corporation
  • Current Assignee Address: JP Kawaguchi
  • Agency: AuerbachSchrot LLC
  • Agent William C. Schrot; Jeffrey I. Auerbach
  • Priority: JPJP2017-225201 20171122,JPJP2018-149346 20180808
  • International Application: PCT/JP2018/041597 WO 20181109
  • International Announcement: WO2019/102865 WO 20190531
  • Main IPC: B01L3/00
  • IPC: B01L3/00
Fluid chip, fluid device, and method for manufacturing same
Abstract:
A fluid chip suitable for a fluid device is disclosed in which an upper surface of a flow passage has another member bonded thereto. The disclosed fluid chip, in which a flow passage is formed, comprises a base material having a top surface forming at least a portion of a bottom surface of a flow passage, and a bonding member which is formed from an elastomer resin and an upper end surface of which is provided in a position higher than the top surface of the base material. The base material has a support post portion which projects from the top surface and defines the height of a side surface of the flow passage, and the support post portion of the base material is embedded in the bonding member.
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