Invention Grant
- Patent Title: Electrostatic chuck device and electrostatic chuck device manufacturing method
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Application No.: US17264705Application Date: 2019-08-02
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Publication No.: US11471987B2Publication Date: 2022-10-18
- Inventor: Keisuke Maeda , Masaki Ozaki , Masayuki Shiojiri , Takeshi Watanabe , Shinichi Maeta , Yuuki Kinpara
- Applicant: SUMITOMO OSAKA CEMENT CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
- Current Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Merchant & Gould P.C.
- Priority: JPJP2018-146324 20180802
- International Application: PCT/JP2019/030485 WO 20190802
- International Announcement: WO2020/027322 WO 20200206
- Main IPC: B23Q3/15
- IPC: B23Q3/15 ; H01J37/32 ; H01L21/683

Abstract:
An electrostatic chuck device comprising a mounting table having a mounting surface, a focus ring; and a cooling element, wherein the mounting table has a holding portion surrounding the mounting surface, the holding portion has an annular groove portion having a through-hole, the holding portion has inner and outer peripheral surfaces which hold the focus ring and are located on both sides of the groove portion, the holding surface satisfies conditions (i) and (ii), (i) a straight line connecting a first point corresponding to an innermost periphery of the holding surface and a second point corresponding to an outermost periphery of the holding surface has a positive or a negative inclination from the innermost periphery toward the outermost periphery, wherein a difference between a height of the first point and a height of the second point is 0 μm to 10 μm, and (ii) leak areas of the inner peripheral surface and the outer peripheral surface are less than 0.7 mm2.
Public/Granted literature
- US20210308812A1 ELECTROSTATIC CHUCK DEVICE AND ELECTROSTATIC CHUCK DEVICE MANUFACTURING METHOD Public/Granted day:2021-10-07
Information query
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