Invention Grant
- Patent Title: Modular communications plug
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Application No.: US17155460Application Date: 2021-01-22
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Publication No.: US11476616B2Publication Date: 2022-10-18
- Inventor: Satish I. Patel , Roman J. Churnovic , Vytas J. Vaitkus , Robert E. Fransen
- Applicant: Panduit Corp.
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Christopher S. Clancy; James H. Williams; Peter S. Lee
- Main IPC: H01R13/58
- IPC: H01R13/58 ; H01R13/506 ; H01R4/2433
Abstract:
A modular communications plug is disclosed having a simplified design that allows for more efficient termination of a cable into the plug. The plug includes modular components that are applicable to different applications.
Public/Granted literature
- US20210242623A1 MODULAR COMMUNICATIONS PLUG Public/Granted day:2021-08-05
Information query
