Invention Grant
- Patent Title: High band access
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Application No.: US16510692Application Date: 2019-07-12
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Publication No.: US11477826B2Publication Date: 2022-10-18
- Inventor: Yeliz Tokgoz , Heechoon Lee , Tingfang Ji , Gavin Bernard Horn , Ozcan Ozturk
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Harrity & Harrity LLP/Qualcomm Incorporated
- Main IPC: H04W74/08
- IPC: H04W74/08 ; H04W72/08 ; H04W76/10 ; H04L5/14 ; H04W68/02

Abstract:
Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive system information for a first cell on a second cell, wherein the UE is camped on the second cell, and wherein the system information for the first cell is received with system information for the second cell; access an uplink of the first cell using the system information for the first cell; and establish a connection on the first cell as a serving cell. Numerous other aspects are provided.
Public/Granted literature
- US20200022189A1 HIGH BAND ACCESS Public/Granted day:2020-01-16
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