Invention Grant
- Patent Title: Highly regular logic design for efficient 3D integration
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Application No.: US16847001Application Date: 2020-04-13
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Publication No.: US11488947B2Publication Date: 2022-11-01
- Inventor: Lars Liebmann , Jeffrey Smith , Daniel Chanemougame , Anton deVilliers
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L27/06

Abstract:
An integrated circuit includes an array of unit cells, each unit cell of which including field effect transistors arranged in a stack. Local interconnect structures form select conductive paths between select terminals of the field effect transistors to define cell circuitry that is confined within each unit cell. An array of contacts is disposed on an accessible surface of the unit cell, where each contact is electrically coupled to a corresponding electrical node of the cell circuitry.
Public/Granted literature
- US20210035967A1 HIGHLY REGULAR LOGIC DESIGN FOR EFFICIENT 3D INTEGRATION Public/Granted day:2021-02-04
Information query
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