Invention Grant
- Patent Title: Electronic device covers
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Application No.: US16959110Application Date: 2018-01-05
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Publication No.: US11493960B2Publication Date: 2022-11-08
- Inventor: Philip Moon , Ilchan Lee , Stacy L. Wolff
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Rahman LLC
- International Application: PCT/US2018/012526 WO 20180105
- International Announcement: WO2019/135759 WO 20190711
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F3/02

Abstract:
An example electronic device cover includes a body component to attach to an electronic device. The body component articulates among a first, second, and third configuration. The body component includes a first section to attach to the electronic device. A second section attaches to the first section, bends with respect to the first section, and provides structural support to the electronic device in the second configuration. A third section attaches to the second section, and bends with respect to the second section. A fourth section attaches to the third section and includes a rotatable data port. An input device attaches to the fourth section and is operatively connected to the data port. The input device is to be held against and face the electronic device in the third configuration. The body component constrains the electronic device within a perimeter boundary of the fourth section in the first and third configurations.
Public/Granted literature
- US20200333841A1 ELECTRONIC DEVICE COVERS Public/Granted day:2020-10-22
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