Invention Grant
- Patent Title: Tolerating memory stack failures in multi-stack systems
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Application No.: US16175926Application Date: 2018-10-31
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Publication No.: US11494087B2Publication Date: 2022-11-08
- Inventor: Georgios Mappouras , Amin Farmahini Farahani , Michael Ignatowski
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Polansky & Associates, P.L.L.C.
- Agent Paul J. Polansky; Nathan H. Calvert
- Main IPC: G06F3/06
- IPC: G06F3/06

Abstract:
Memory management circuitry and processes operate to improve reliability of a group of memory stacks, providing that if a memory stack or a portion thereof fails during the product's lifetime, the system may still recover with no errors or data loss. A front-end controller receives a block of data requested to be written to memory, divides the block into sub-blocks, and creates a new redundant reliability sub-block. The sub-blocks are then written to different memory stacks. When reading data from the memory stacks, the front-end controller detects errors indicating a failure within one of the memory stacks, and recovers corrected data using the reliability sub-block. The front-end controller may monitor errors for signs of a stack failure and disable the failed stack.
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