Invention Grant
- Patent Title: Soft magnetic alloy and magnetic component
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Application No.: US16971338Application Date: 2019-02-15
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Publication No.: US11495377B2Publication Date: 2022-11-08
- Inventor: Hajime Amano , Akihiro Harada , Kenji Horino , Hiroyuki Matsumoto , Kazuhiro Yoshidome , Akito Hasegawa , Kensuke Ara , Masakazu Hosono
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-028911 20180221
- International Application: PCT/JP2019/005513 WO 20190215
- International Announcement: WO2019/163660 WO 20190829
- Main IPC: H01F1/153
- IPC: H01F1/153 ; C22C45/00

Abstract:
Provided is a soft magnetic alloy which has high saturation flux density and low coercivity and is represented by the compositional formula (Fe(1−(α+β))X1αX2β)(1−(a+b+c+d+e+f))MaPbSicCudX3eBf, wherein X1 is at least one element selected from the group consisting of Co and Ni, X2 is at least one element selected from the group consisting of Ti, V, Mn, Ag, Zn, Al, Sn, As, Sb, Bi, and rare earth elements, X3 is at least one element selected from the group consisting of C and Ge, and M is at least one element selected from the group consisting of Zr, Nb, Hf, Ta, Mo, and W, and wherein 0.030≤a≤0.120, 0.010≤b≤0.150, 0≤c≤0.050, 0≤d≤0.020, 0≤e≤0.100, 0≤f≤0.030, α≥0, β≥0, and 0≤α+β≤0.55.
Public/Granted literature
- US20210020342A1 SOFT MAGNETIC ALLOY AND MAGNETIC COMPONENT Public/Granted day:2021-01-21
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