Invention Grant
- Patent Title: Coil electronic component
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Application No.: US16003901Application Date: 2018-06-08
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Publication No.: US11495398B2Publication Date: 2022-11-08
- Inventor: Young Il Lee , Han Wool Ryu , Sang Kyun Kwon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0135379 20171018
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/32 ; H01F1/147 ; H01F27/255 ; H01F17/04 ; H01F17/00 ; C23C16/455 ; H01F1/26 ; C23C16/40 ; H01F1/33 ; H01F41/02
Abstract:
A coil electronic component includes a body including an insulator; a coil portion embedded in the body; aggregates dispersed in the insulator, where the aggregates each comprise a plurality of magnetic particles, coating layers formed on surfaces of the aggregates using an insulating material, and external electrodes connected to the coil portion.
Public/Granted literature
- US20190115147A1 COIL ELECTRONIC COMPONENT Public/Granted day:2019-04-18
Information query
