Invention Grant
- Patent Title: Semiconductor package structure and method for manufacturing the same
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Application No.: US17006664Application Date: 2020-08-28
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Publication No.: US11495511B2Publication Date: 2022-11-08
- Inventor: Yu-Che Huang , Lu-Ming Lai , Ying-Chung Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/32
- IPC: H01L23/32 ; H01L23/498 ; H01L21/48
Abstract:
A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package device, a first constraint structure and a second constraint structure. The first constraint structure is connected to the semiconductor package device. The second constraint structure is connected to the semiconductor package device and under a projection of the semiconductor package device.
Public/Granted literature
- US20220068747A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-03-03
Information query
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