- Patent Title: Light emitting device and method of producing light emitting device
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Application No.: US16584092Application Date: 2019-09-26
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Publication No.: US11495587B2Publication Date: 2022-11-08
- Inventor: Takuya Nakabayashi , Tadaaki Ikeda , Tetsuya Ishikawa
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Hunton Andrews Kurth LLP
- Priority: JPJP2018-182282 20180927,JPJP2019-056122 20190325,JPJP2019-095269 20190521
- Main IPC: H01L25/13
- IPC: H01L25/13 ; H01L33/52 ; H01L33/62

Abstract:
A light emitting device includes a substrate including first, second, third and fourth wiring portions on a top surface of a base member and arrayed in a first direction, and a connection wiring portion connecting the second and third wiring portions. The connection wiring portion includes first and second connection ends respectively connected with the second and third wiring portions, and a connection central portion connecting the first and second connection ends and having a maximum width in a second direction different from each of a maximum width of the first connection end and a maximum width of the second connection end. In the second direction, at least a part of the connection wiring portion has a width narrower than each of a maximum width of the second wiring portion and a maximum width of the third wiring portion.
Information query
IPC分类: