Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US17147468Application Date: 2021-01-13
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Publication No.: US11495686B2Publication Date: 2022-11-08
- Inventor: Chi-Hsuan Tang , Chung-Ting Huang , Bo-Shiun Chen , Chun-Jen Chen , Yu-Shu Lin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN202011478662.1 20201215
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/06 ; H01L21/02

Abstract:
A method for fabricating a semiconductor device includes the steps of first forming a gate structure on a substrate, forming a first spacer adjacent to the gate structure, forming a second spacer adjacent to the first spacer, forming an epitaxial layer adjacent to the second spacer, forming a second cap layer on the epitaxial layer, and then forming a first cap layer on the second cap layer. Preferably, a top surface of the first cap layer includes a V-shape and the first cap layer and the second cap layer are made of different materials.
Public/Granted literature
- US20220190160A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2022-06-16
Information query
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