Invention Grant
- Patent Title: Exposure method and exposure apparatus
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Application No.: US16994804Application Date: 2020-08-17
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Publication No.: US11500299B2Publication Date: 2022-11-15
- Inventor: Yung-Yao Lee , Heng-Hsin Liu , Hung-Ming Kuo , Jui-Chun Peng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: G03F9/00
- IPC: G03F9/00 ; G03F7/20 ; H01L21/67 ; H01L21/027 ; H01L21/66

Abstract:
In a method executed in an exposure apparatus, a focus control effective region and a focus control exclusion region are set based on an exposure map and a chip area layout within an exposure area. Focus-leveling data are measured over a wafer. A photo resist layer on the wafer is exposed with an exposure light. When a chip area of a plurality of chip areas of the exposure area is located within an effective region of a wafer, the chip area is included in the focus control effective region, and when a part of or all of a chip area of the plurality of chip areas is located on or outside a periphery of the effective region of the wafer, the chip area is included in the focus control exclusion region In the exposing, a focus-leveling is controlled by using the focus-leveling data measured at the focus control effective region.
Public/Granted literature
- US20200379361A1 EXPOSURE METHOD AND EXPOSURE APPARATUS Public/Granted day:2020-12-03
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