Invention Grant
- Patent Title: Multilayer capacitor and multilayer capacitor array
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Application No.: US17007022Application Date: 2020-08-31
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Publication No.: US11501923B2Publication Date: 2022-11-15
- Inventor: Yukihiro Fujita , Kazuhiro Tabata , Shunsuke Abe , Takayuki Okada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2019-169899 20190918
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G2/02 ; H01G4/12 ; H01G4/012

Abstract:
A multilayer capacitor includes a capacitor main body including dielectric layers, first inner electrodes, and second inner electrodes that are laminated together, first outer electrodes, second outer electrodes, first via conductors that electrically connect the respective first outer electrodes to the first inner electrodes, and second via conductors that electrically connect the respective second outer electrodes to the second inner electrodes. Through holes are provided in the second inner electrodes, and the first via conductors pass through the through holes. Through holes are provided in the first inner electrodes, and the second via conductors pass through the through holes. The first outer electrodes and the second outer electrodes are not provided on the first principal surface of the capacitor main body and provided only on its second principal surface.
Public/Granted literature
- US20210082625A1 MULTILAYER CAPACITOR AND MULTILAYER CAPACITOR ARRAY Public/Granted day:2021-03-18
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