公开(公告)号：US12154709B2

公开(公告)日：2024-11-26

申请号：US17350624

申请日：2021-06-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshimasa Yoshioka ,  Tatsuya Funaki ,  Shunsuke Abe

IPC: H01F27/28 ,  H01F27/06 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

Abstract: A surface-mount passive component includes a passive element and a size conversion unit on which the passive element is mounted. The size conversion unit has a body, a plurality of first external terminals each of which is exposed on an element mount surface of the body and is electrically connected to a corresponding one of passive element external terminals of the passive element, a plurality of second external terminals exposed on a board-side mount surface of the body, and connection wires that electrically connect the first external terminals and the second external terminals. An area of the board-side mount surface is larger than an area of a first main surface of the passive element, and a total area of the plurality of second external terminals on the board-side mount surface is larger than a total area of the passive element external terminals on the first main surface.

公开(公告)号：US10650974B2

公开(公告)日：2020-05-12

申请号：US15916386

申请日：2018-03-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kohei Shimada ,  Akio Masunari ,  Yuta Saito ,  Shunsuke Abe ,  Tomoo Yuguchi

IPC: H01G4/30 ,  H01G4/005 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/012

Abstract: A multilayer ceramic capacitor includes a laminate with a rectangular or substantially rectangular parallelepiped shape and including dielectric layers, first internal electrode layers, and second internal electrode layers that are laminated; a first external electrode connected with the first internal electrode layers; and a second external electrode connected with the second internal electrode layers. Each of the first internal electrode layers or the second internal electrode layers has a coverage in a central portion in a W direction that is lower than a coverage within about 30.000 μm from an end portion in the W direction, and has a shifting amount in the W direction of about 0.000 μm or more and about 10.000 μm or less.

公开(公告)号：US12002760B2

公开(公告)日：2024-06-04

申请号：US17490424

申请日：2021-09-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tatsuya Funaki ,  Shunsuke Abe

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/5382 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/5384 ,  H01L23/5386

Abstract: A composite component that includes an interposer structure and an electronic component. The interposer structure includes a Si base layer having a first main surface and a second main surface facing each other, a rewiring layer on the first main surface, a through Si via electrically connected to the rewiring layer and penetrating the Si base layer, an interposer electrode facing the second main surface, and an adhesive layer. The electronic component has a surface and a component electrode on the surface and connected to the through Si via, and is located between the interposer electrode and the Si base layer such that the component electrode and the surface are adhered to the second main surface of the Si base layer with the adhesive layer interposed therebetween. The through Si via extends from the second main surface, penetrates the adhesive layer, and is electrically connected to the component electrode.

公开(公告)号：US11501923B2

公开(公告)日：2022-11-15

申请号：US17007022

申请日：2020-08-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukihiro Fujita ,  Kazuhiro Tabata ,  Shunsuke Abe ,  Takayuki Okada

IPC: H01G4/30 ,  H01G2/02 ,  H01G4/12 ,  H01G4/012

Abstract: A multilayer capacitor includes a capacitor main body including dielectric layers, first inner electrodes, and second inner electrodes that are laminated together, first outer electrodes, second outer electrodes, first via conductors that electrically connect the respective first outer electrodes to the first inner electrodes, and second via conductors that electrically connect the respective second outer electrodes to the second inner electrodes. Through holes are provided in the second inner electrodes, and the first via conductors pass through the through holes. Through holes are provided in the first inner electrodes, and the second via conductors pass through the through holes. The first outer electrodes and the second outer electrodes are not provided on the first principal surface of the capacitor main body and provided only on its second principal surface.

公开(公告)号：US20220020692A1

公开(公告)日：2022-01-20

申请号：US17490424

申请日：2021-09-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tatsuya Funaki ,  Shunsuke Abe

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/29 ,  H01L21/48 ,  H01L21/56

Abstract: A composite component that includes an interposer structure and an electronic component. The interposer structure includes a Si base layer having a first main surface and a second main surface facing each other, a rewiring layer on the first main surface, a through Si via electrically connected to the rewiring layer and penetrating the Si base layer, an interposer electrode facing the second main surface, and an adhesive layer. The electronic component has a surface and a component electrode on the surface and connected to the through Si via, and is located between the interposer electrode and the Si base layer such that the component electrode and the surface are adhered to the second main surface of the Si base layer with the adhesive layer interposed therebetween. The through Si via extends from the second main surface, penetrates the adhesive layer, and is electrically connected to the component electrode.