Invention Grant
- Patent Title: Integrated device comprising a CMOS structure comprising well-less transistors
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Application No.: US16817446Application Date: 2020-03-12
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Publication No.: US11502079B2Publication Date: 2022-11-15
- Inventor: Stanley Seungchul Song , Hyunwoo Park , Peijie Feng
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP/Qualcomm
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/06

Abstract:
An integrated device that includes a substrate, a first transistor, and a second transistor. The second transistor is configured to be coupled to the first transistor. The first transistor is configured to operate as a N-type channel metal oxide semiconductor transistor (NMOS) transistor. The first transistor includes a dielectric layer disposed over the substrate; a first source disposed over the dielectric layer; a first drain disposed over the dielectric layer; a first plurality of channels coupled to the first source and the first drain; and a first gate surrounding the plurality of channels. The second transistor is configured to operate as a P-type channel metal oxide semiconductor transistor (PMOS). The second transistor includes the dielectric layer; a second source disposed over the dielectric layer; a second drain disposed over the dielectric layer; a second plurality of channels coupled to the second source and the second drain; and a second gate.
Public/Granted literature
- US20210057410A1 INTEGRATED DEVICE COMPRISING A CMOS STRUCTURE COMPRISING WELL-LESS TRANSISTORS Public/Granted day:2021-02-25
Information query
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