Invention Grant
- Patent Title: Enhanced lift pin design to eliminate local thickness non-uniformity in teos oxide films
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Application No.: US16664396Application Date: 2019-10-25
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Publication No.: US11508611B2Publication Date: 2022-11-22
- Inventor: Kalyanjit Ghosh , Mayur G. Kulkarni , Sanjeev Baluja , Praket P. Jha , Krishna Nittala
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/687
- IPC: H01L21/687 ; C23C16/458
Abstract:
Implementations disclosed herein generally provide a lift pin that can improve the deposition rate and uniform film thickness above lift pin areas. In one implementation, the lift pin includes a first end coupling to a shaft, the first end having a pin head, and the pin head having a top surface, wherein the top surface is planar and flat, and a second end coupling to the shaft, the second end having a flared portion, wherein the flared portion has an outer surface extended along a direction that is at an angle of about 110° to about 140° with respect to a longitudinal axis of the lift pin.
Public/Granted literature
- US20200058538A1 ENHANCED LIFT PIN DESIGN TO ELIMINATE LOCAL THICKNESS NON-UNIFORMITY IN TEOS OXIDE FILMS Public/Granted day:2020-02-20
Information query
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