- 专利标题： Enhanced lift pin design to eliminate local thickness non-uniformity in teos oxide films
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申请号： US16664396申请日： 2019-10-25
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公开(公告)号： US11508611B2公开(公告)日： 2022-11-22
- 发明人: Kalyanjit Ghosh , Mayur G. Kulkarni , Sanjeev Baluja , Praket P. Jha , Krishna Nittala
- 申请人： Applied Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson + Sheridan, LLP
- 主分类号： H01L21/687
- IPC分类号： H01L21/687 ; C23C16/458
摘要：
Implementations disclosed herein generally provide a lift pin that can improve the deposition rate and uniform film thickness above lift pin areas. In one implementation, the lift pin includes a first end coupling to a shaft, the first end having a pin head, and the pin head having a top surface, wherein the top surface is planar and flat, and a second end coupling to the shaft, the second end having a flared portion, wherein the flared portion has an outer surface extended along a direction that is at an angle of about 110° to about 140° with respect to a longitudinal axis of the lift pin.
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