- 专利标题: Semiconductor device
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申请号: US17197107申请日: 2021-03-10
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公开(公告)号: US11508647B2公开(公告)日: 2022-11-22
- 发明人: Toru Sugiyama , Akira Yoshioka , Hung Hung , Yasuhiro Isobe , Hitoshi Kobayashi , Tetsuya Ohno , Naonori Hosokawa , Masaaki Onomura , Masaaki Iwai
- 申请人: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- 申请人地址: JP Tokyo; JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- 当前专利权人: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- 当前专利权人地址: JP Tokyo; JP Tokyo
- 代理机构: Allen & Overy LLP
- 优先权: JPJP2020-153000 20200911
- 主分类号: H01L23/52
- IPC分类号: H01L23/52 ; H01L23/495 ; H01L29/778 ; H01L49/02 ; H01L29/866
摘要:
A semiconductor device includes a semiconductor package including an n-type channel normally-off transistor, a normally-on transistor, a first diode, and a Zener diode; a first terminal provided on the semiconductor package; a plurality of second terminals provided on the semiconductor package, and the second terminals being lined up in a first direction; a third terminal provided on the semiconductor package; a plurality of fourth terminals provided on the semiconductor package; and a plurality of fifth terminals provided on the semiconductor package, and the fifth terminals being lined up in the first direction.
公开/授权文献
- US20220084916A1 SEMICONDUCTOR DEVICE 公开/授权日:2022-03-17