- 专利标题： Semiconductor package and method
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申请号： US17359892申请日： 2021-06-28
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公开(公告)号： US11508656B2公开(公告)日： 2022-11-22
- 发明人: Kuo Lung Pan , Shu-Rong Chun , Teng-Yuan Lo , Hung-Yi Kuo , Chih-Horng Chang , Tin-Hao Kuo , Hao-Yi Tsai
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L21/48 ; H01L21/56 ; H01L21/768 ; H01L23/29 ; H01L23/31 ; H01L23/498 ; H01L23/00 ; H01L25/065
摘要：
In an embodiment, a device includes: a first redistribution structure including a first dielectric layer; a die adhered to a first side of the first redistribution structure; an encapsulant laterally encapsulating the die, the encapsulant being bonded to the first dielectric layer with first covalent bonds; a through via extending through the encapsulant; and first conductive connectors electrically connected to a second side of the first redistribution structure, a subset of the first conductive connectors overlapping an interface of the encapsulant and the die.
公开/授权文献
- US20210327806A1 Semiconductor Package and Method 公开/授权日：2021-10-21
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