Invention Grant
- Patent Title: Layout construction for addressing electromigration
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Application No.: US16777639Application Date: 2020-01-30
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Publication No.: US11508725B2Publication Date: 2022-11-22
- Inventor: Seid Hadi Rasouli , Michael Joseph Brunolli , Christine Sung-An Hau-Riege , Mickael Malabry , Sucheta Kumar Harish , Prathiba Balasubramanian , Kamesh Medisetti , Nikolay Bomshtein , Animesh Datta , Ohsang Kwon
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Chui-Kiu Teresa Wong
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L23/482 ; H01L27/02 ; H01L23/528 ; H01L21/8238 ; H01L23/522 ; H03K17/16 ; H03K17/687

Abstract:
A CMOS device with a plurality of PMOS transistors each having a PMOS drain and a plurality of NMOS transistors each having an NMOS drain includes a first interconnect and a second interconnect. The first interconnect is on an interconnect level extending in a length direction to connect the PMOS drains together, and the second interconnect is on the interconnect level extending in the length direction to connect the NMOS drains together. A set of interconnects on at least one additional interconnect level physically couple the first interconnect and the second interconnect to an output of the CMOS device. A third interconnect on the interconnect level extends perpendicular to the length direction and offset from the set of interconnects. The third interconnect is capable of flowing current from the PMOS drains or from the NMOS drains to the output of the CMOS device.
Public/Granted literature
- US20200168604A1 LAYOUT CONSTRUCTION FOR ADDRESSING ELECTROMIGRATION Public/Granted day:2020-05-28
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